UNISOC announces ambitious 5G chipsets

The UNISOC Tanggula 5G chip family includes models that will compete from entry level to Snapdragon 8xx level. We will hear the name UNISOC more in the new period.

The fact that 5G infrastructures will create a market of more than $ 200 trillion has enabled manufacturers to allocate a large investment share. Producers who want to get a share of the cake develop products that will be competitive.

What does UNISOC Tanggula offer?

Chinese UNISOC, which we have seen to be appreciated with a few chipsets recently, announced the new Tanggula 5G family chipsets that it aims to be in every segment. The details are not clear yet, but some of the chips introduced previously have been renamed.

UNISOC is divided into Tanggula 5G family as Tanggula 6, Tanggula 7, Tanggula 8 and Tanggula 9. Tanggula 9 series has models that can compete with the Snapdragon 800 series. For now, we have information about the Tanggula 7 series.

The Tanggula T770 was previously introduced as the T7250 and was the first mobile chip in the 6nm process. The chipset with 1 x Cortex-A76 + 3 x Cortex-A76 + 4 x Cortex-A55 array contains the Mali G57 graphics unit. Supported by Vivimagic 6.0 image processor and 4-core image signal processor, Tanggula T770 is currently the most powerful chipset in the family.

Tanggula T740 is renamed the T7510 chip. The chip with 4x Cortex-A76 + 4x Cortex-A55 array has Vivimagic 6.0 image processor and is also in 6nm process. A little more will join the competition towards the lower middle level. UNISOC T760 is in 12nm process and has 4x Cortex-A75 + 4x Cortex-A55 array. This will also approach the entry level. At the entry level, Tanggula 6 series will welcome us.

There will be 9 series in the most curious form in the UNISOC Tanggula family. It is not yet known what optimizations it will offer to challenge the flagship Snapdragon 800 chipsets and how it will affect the competition.

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